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Transcend to Showcase its Embedded Solutions at Flash Memory Summit 2017

Transcend Information, Inc. (Transcend ), a leading manufacturer of embedded products, will be exhibiting at Flash Memory Summit 2017 with an extensive product portfolio and embedded technologies, including their latest solid state drives, memory cards, and memory modules. Flash Memory Summit 2017 will take place at the Santa Clara Convention Center in Santa Clara, CA, August 8th through August 10th. Visitors will find Transcend at Booth #724.
Exclusive Products for Embedded Applications 
Participating at Flash Memory Summit for the second time this year, Transcend is proud to display an advanced embedded product portfolio, including the latest SATA III 6Gb/s SSDs, M.2 SSDs, mSATA and half-slim SATA SSDs, a new PCIe M.2 SSD, flash cards, and memory modules. Engineered for long life and maximum durability, Transcend’s embedded solutions undergo extensive reliability testing, and offer extended temperature solutions to ensure peak operation under the harshest environmental conditions. 
New Embedded Solutions
Transcend will be displaying four embedded technologies for the first time: Intelligent Power Shield, AES encryption, SuperMLC, and Wide Temperature. For data security, Transcend offers Intelligent Power Shield (IPS) technology, which can operate at 5V in the event of a sudden power outage to ensure the data integrity of DRAM and SSDs. Transcend also offers hardware-based Advanced Encryption Standard (AES) encryption to protect sensitive electronic data. For high endurance and high performance applications, Transcend’s exclusive SuperMLC technology offers a solution that approaches the performance of SLC NAND flash. Transcend’s customized firmware reprograms the two bits per cell of MLC NAND into one bit per cell, allowing SuperMLC technology to perform similar to SLC NAND at a more competitive price point. Lastly, for devices that must be operated under the harshest of conditions, Transcend utilizes a proprietary wide temperature testing process to ensure the reliability of both its flash products and DRAM modules. 
Live Demonstration: PCIe SSD
In addition to displaying a comprehensive embedded product lineup, Transcend will demonstrate its newly released PCIe Gen3 x4 MTE850 M.2 SSD with 3D NAND flash technology. Unlike existing planar NAND chips, 3D NAND flash is a type of flash memory in which the memory cells are stacked vertically in multiple layers, delivering a greater level of performance and endurance. Transcend's MTE850 M.2 SSD follows NVMe 1.2 and utilizes the PCIe Gen3 x4 interface, whereby four lanes are used for transmitting and receiving data simultaneously, resulting in compelling performance of up to 2500MB/s read and 1100MB/s write*. 
About Flash Memory Summit
Flash memory is a key technology enabling new designs for many products in the consumer, computer and enterprise markets. Flash Memory Summit is the only place where you will hear from the people making these products happen while networking with companies and people that will create the next generation of hardware and software. For more information about Flash Memory Summit 2017, please visit 
*Note: Performance may vary among SSD models. Please refer to Transcend website for more detailed information.