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Shuttle SPC series edge PCs feature a compact 0.45-liter design (120x51x75 mm), balancing size, performance, and adaptability in industrial computing. Much smaller than mainstream 1.8-3 liter AI edge systems, the SPC offers advanced thermal design, wide-temperature operation (-20°C to 60°C), and meets EN50155 (railway) and MIL-STD-810G (military) standards.
The SPC series supports Intel and NVIDIA platforms with flexible configurations. Its modular design enables adaptable I/O, 5G/LTE/Wi-Fi connectivity, and DIN rail/VESA mounting—suitable for manufacturing, robotics, transportation, energy, and smart cities. Some configurations deliver up to 100 TOPS AI performance in palm-sized form, ideal for real-time image recognition and multi-sensor processing.
As AIoT grows, demand rises for responsive edge solutions. The SPC series enables low-latency, privacy-focused deployments in tight spaces and critical settings like factory automation, remote monitoring, and outdoor AI sensing.