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TAIPEI, TAIWAN (November 13, 2017) – Acer today announced its new Altos W2200h-W670h F4 high-density multi-node server ahead of the SC17 supercomputing conference in Denver. With a 2U rack-mountable form factor supporting four front-access compute nodes, it is ideal for high-performance computing, deep learning and in-memory database applications with compute-intensive and memory-intensive workloads.
For enterprise customers seeking to maximize the efficiency of their data centers, the new Acer Altos W2200h-W670h F4 can be configured with liquid cooling to support processors with a higher TDP (Thermal Design Power) and thereby lowering the PUE (Power Usage Effectiveness).
Optimal Inference Acceleration Configuration With Up to Three PCIe® x16 Slots per Node
As an enhancement over previous generation multi-node servers, the W2200h chassis includes I/O cages for each of the compute nodes located at the rear. Each I/O cage includes two PCIe® 3.0 x16 slots supporting low-profile/half-height cards, while the compute nodes include a front-facing slot, allowing each node to support three NVIDIA® Tesla® P4 inference accelerators (12 per chassis) or FPGA cards as needed.
Up to 24 DIMM Slots per Node for In-memory Data Analytics and Lower Cost per VM
Featuring dual Intel® Xeon® Scalable processors, each W670h F4 compute node supports up to 3 TB of DDR4 ECC 2666 MHz memory with 24 DIMM slots while two 2.5-inch SATA SSD drive bays are available with built in Intel® RSTe RAID 0/1 support. Connectivity includes dual port RJ45 10 GbE interfaces provided by the Intel® Ethernet Controller X550, one 1 Gb management port, two USB 3.0 ports and a VGA port. In addition, the W2200h chassis supports a CMC (Chassis Management Controller) to simplify cabling and allows for easier installation and management.
Exact specifications, prices, and availability will vary by region. To learn more about availability, product specifications and prices in specific markets, please contact your nearest Acer office via www.acer.com.