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The case subsidized by IDB in 2018 is the world’s first “formic acid(FA) vacuum reflow oven for solder paste”.
Feature:
*The quantity of FA can be controlled intelligently,and the consumption of FA is 1% of that of competitors.
*If the oven replaces the traditional soldering process,it can reduce waste solvent by 31 tons/year.
*The unique transferring system and acid supply system can increase capacity by 2-8 times.It can greatly reduce production cost of customers.
*The patented oven design has high heat transfer efficiency and saves 50% of energy.
*The exhaust gas is treated by plasma.No harmful gas emitting meets with EHS standard.
*Extremely low void rate and no flux residue improve the reliability of semiconductor components by 43%.It suits for high-reliability products such as IGBT,Power MOS,diodes,Copper Pillar Bumping, Sip Power Module and Micro LED.
*After verification by Infineon,the oven will be standard high-end IGBT packaging equipment.
