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GTR-1215 Simple and compact single-axis grinder is a high-precision grinding machine with simple operation, abundant function and great value. Equipped with automatic thickness measurement and compensation system which can automatically grind wafers to the required dimension. It has one spindle and one chuck table and is designed to process a variety of materials up to 12” ~15” in diameter. The key components of the grinding spindle and rotating worktable adopt high-precision, high-rigidity, vibration & wear resistant Hydrostatic Bearings, which ensures high rotation accuracy and greatly guarantees high-precision grinding, high-efficiency and high stability. In turn, the thinning yield rate is improved too.
*With intelligent touch screen & graphical user interface, easy to operate.
*With processing data archiving function for convenient management.
*Continuously monitoring the working load during grinding process & automatically adjusting the grinding speed.
