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The 3S Advanced Formic Acid Vacuum Reflow Oven builds upon 3S's proven formic acid vacuum reflow technology and embodies a customer-centric philosophy, characterized by rapid responsiveness to customer requirements and an unwavering commitment to innovation in overcoming technical challenges. The system has been specifically developed to address the demanding packaging requirements of advanced automotive power modules, IGBT, SiC and GaN power devices, AI server power modules, and large-size Fan-Out packaging processes. The working area has been expanded to 300 × 400 mm and supports inline integration with upstream and downstream manufacturing processes. The formic acid reservoir capacity has been increased from 2.5 L to 25 L, substantially reducing replenishment frequency and maintenance-related downtime. Under continuous operation, energy consumption can be reduced by up to 7.14%, delivering enhanced manufacturing efficiency, customer value, and ESG-related carbon reduction benefits.
