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Aurotek LED Die Bonding Tester JD2020-DAI is a world leading total quality inspection instrument used for flip-chip type LED manufacture, to replace the ultrasonic scanning technology to detect the void rate of flip-chip bonding. It makes innovative package designs with a properly determined material property identification, and facile the product life failure estimation.
The high speed in-line Rth technique effectively facilities measurement procedure, that is remarkably reducing measurement time with achieving the same results. Successfully integrated with automation machine, JD-2020-DAI imports in-line thermal resistance testing value, which may distinguish the die attach quality of flip-chip LED.
The key innovation is to provide a ready-to-use solution to production line without altering the original production process design.
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Award winning products in the past (18)
