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In the semiconductor and panel photolithography processing equipment, the highest concentration of VOCs is generated by coating, vacuum drying, soft baking, and hard baking equipment. This product can replace traditional VOCs treatment techniques such as condensation, adsorption, and washing methods to remove VOC emissions from the photolithography process. It achieves a long-lasting and low-pollution VOC removal method, reducing the environmental impact of VOCs and effectively improving process yield.
1. Removal efficiency >80-90%
2. Precise temperature and humidity control: temperature ±0.5°C, humidity ±2%RH
3. Reduction of 202 tons of carbon emissions per year per unit.
4. WCF water catalyst:
It utilizes a water catalyst to convert VOCs and ion adsorption plates to capture ionized VOCs, achieving a long-lasting method of VOC removal using water.
5. Water-washing filtration device:
By utilizing parallel convection between liquid and gas, it reduces water usage.
