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Our self-developed multi-station wafer grinding machine targets critical semiconductor needs like TTV and warp control for advanced packaging and wafer thinning. It features proprietary air/liquid hydrostatic spindles and rotary tables, plus a patented tilt table and endpoint thickness detection for precise, uniform results.
The custom HMI and control system enable real-time monitoring, data logging, and MES integration, enhancing process transparency and quality control.
From an ESG standpoint, the software-controlled cutting water system optimizes water use based on load and tool status, reducing waste and environmental impact.
An open consumable policy allows flexible, brand-independent choices, lowering costs and supporting local supply chains.
This machine delivers precision, flexibility, and sustainability to meet evolving semiconductor wafer grinding demands.

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