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Introduce screen printing into semiconductor process : energy saving. Custom-made for wafer packaging process to print chemical / Tin paste, replace rotary coating + photo-mask, filling grooves or protective paste on wafer surface, lower usage rate of Lithography machine & water cleaning in subsequent wet process. Save water, electricity and chemicals to avoid environmental pollution. 1)Marketing Goal : advanced packaging factory, as ASE Group, WLCSP, Huatian, etc. 2)Visual Registration : accuracy ±5µm Auto registering, collocated with platform, learning screen position to align wafer fastly. 3)Uniform Layer : accuracy 1 ~ 2µm Auto squeegee leveling achieves even layer & micron-level precision to ensure yield rate. 4)Quick Registration : ≦ 2min When changing screen, target at FOV center with display assistance for fast positioning. 5)Dual Usage (protective glue / Tin paste) 6)Retractable Frame Pull out for cleaning screen, easy operating, safety & comfort.
Other award winning products for the year (2)
Award winning products in the past (21)
