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Advanced PCB process : challenges and opportunities NVIDIA AI demand drives advanced PCB innovation. Lacking equipment, key suppliers lead with automated lines to boost scale, speed, and competitiveness. Product Innovation Highlights *240kgf pressure enables stable micro via filling (0.15–0.2mm), improving process reliability and yield. *Slip wheel design ensures low damage transport, protecting ultra rough copper surfaces. *Universal transfer supports thin / thick boards with stable clamping for mass production. *CCD vision with digital compensation cuts errors, achieving ±0.05mm precision. Marketing Innovation Highlights *Targeting AI-Driven PCB market gap with automated solutions for stable mass production. *CCD alignment with digital compensation achieves ±0.05mm precision. *Fast line change with digital prompts boosts setup speed and utilization. Triple print with single bake saves 66% energy, driving low carbon ESG manufacturing.






















